ASML's Next Big Chipmaking Cycle Has a Timeline—Intel, Samsung and TSMC Set It
Key takeaways
- ASML’s High‑NA EUV is moving into production, with Intel already using it and Samsung/TSMC targeting 2028/2030, setting a clear two‑speed growth path for the company.
- Intel exposed >1 million wafers with High‑NA EUV
- High‑NA fleet availability ~90%
- Samsung 2028 high‑volume target
What happened
ASML announced that its High‑NA EUV technology is moving from development into production, with Intel already exposing over 1 million wafers and Samsung targeting 2028 and TSMC 2030 for high‑volume manufacturing. ASML’s existing High‑NA fleet is now about 90 % available, and the company expects 2027 capacity for low‑NA EUV and DUV immersion systems to rise 30 % YoY, though planned output in 2027‑28 may still fall short of demand.
Why it matters
The timeline shows when the biggest chipmakers will start using ASML’s most advanced machines, defining the next wave of equipment spending. Intel’s early adoption signals that High‑NA is production‑ready, while Samsung’s and TSMC’s dates set industry expectations for when the technology will scale. ASML’s capacity…
Short-term and longer-term
Short-term. In the next few weeks, watch for any updates on Samsung’s 2028 rollout and TSMC’s 2030 plans, as these will influence ASML’s order book.
Longer-term. Over the next 12–18 months, ASML’s long‑term growth hinges on how quickly Samsung and TSMC adopt High‑NA EUV.